Organic light emitting diode display and method of manufacturing the same

ABSTRACT

Disclosed is an organic light emitting diode display including an organic light emitting display panel configured to display an image, and a lower passivation film attached to a bottom of the organic light emitting diode display panel. The lower passivation film includes a support film that is in contact with the organic light emitting diode display panel, and a stress adjustment layer formed beneath the support film and configured to reduce a bending stress to be induced in the organic light emitting display panel when the organic light emitting display panel and the lower passivation film are bent.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.14/221,128, filed on Mar. 20, 2014 and claims priority to, and thebenefit of, Korean Patent Application Nos. 10-2013-0106747 and10-2013-0057249 filed in the Korean Intellectual Property Office on Sep.5, 2013 and May 21, 2013 respectively, the entire contents of each ofwhich are incorporated herein by reference.

BACKGROUND OF THE INVENTION

(a) Field of the Invention

Embodiments of the present invention relate generally to flat paneldisplays. More specifically, embodiments of the present invention relateto an organic light emitting diode display and a method of manufacturingthe same.

(b) Description of the Related Art

An organic light emitting diode display includes organic light emittingelements that each have a hole injection electrode, an organic lightemitting layer, and an electron injection electrode. Each organic lightemitting element emits light due to energy generated when an excitongenerated by combining electrons and holes in the organic light emittinglayer falls from an exited state to a lower state.

Since the organic light emitting element may deteriorate due to externalfactors such as external moisture, oxygen, or ultraviolet (UV) rays, itis desirable to seal the organic light emitting element. Further, it isoften desirable for the organic light emitting diode display to have asmall thickness or be easily bent, in order to apply the organic lightemitting element to various applications. A thin film encapsulation(TFE) technology has seen recent use in the development of thin sealedorganic light emitting diode displays. The thin film encapsulationtechnology often entails alternately laminating one or more inorganiclayers and organic layers on the organic light emitting elements formedin a display region of a display substrate, to cover the display regionwith a thin film encapsulation layer. When the display substrate of theorganic light emitting diode display having the thin film encapsulationlayer is formed of a flexible film such as polyimide (PI), the displaysubstrate is easily bent and useful for a reduction in thickness.

When the flexible organic light emitting diode display is bent, stressoccurs. Specifically, tensile stress occurs toward the convex outersurface and compressive stress occurs toward the concave inner surface.A neutral plane NP at which no stresses are present occurs in anintermediate region between the inner and outer surfaces. Only when theorganic light emitting element is positioned in the neutral plane arepicture abnormalities avoided in the organic light emitting diodedisplay.

However, when the thickness of the organic light emitting diode displayis increased by internal and external films such as a polarizing filmand a passivation film attached to the organic light emitting diodedisplay, the tensile stress and the compressive stress are increased andthe neutral plane becomes displaced. Accordingly, it is difficult toposition the organic light emitting element in the neutral plane.Further, since the organic light emitting diode display has a layeredstructure made of complex materials, asymmetry of strains occurs due toa difference in tensile stress and compressive stress at the inner andouter surfaces of a bent bending portion. Accordingly, it is difficultto position the organic light emitting element in the neutral plane,thus giving rise to picture abnormalities.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the invention, andtherefore it may contain information that does not form the prior artthat is already known in this country to a person of ordinary skill inthe art.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide an organic light emittingdiode display selectively adjusting a strain of a bent portion to reducestress in the bent portion, as well as a method of manufacturing thesame.

An exemplary embodiment of the present invention provides an organiclight emitting diode display including an organic light emitting displaypanel configured to display an image. A lower passivation film isattached to a bottom of the organic light emitting diode display panel.The lower passivation film includes a support film that is in contactwith the organic light emitting diode display panel. A stress adjustmentlayer is formed beneath the support film and configured to reduce abending stress to be induced in the organic light emitting display panelwhen the organic light emitting display panel and the lower passivationfilm are bent.

The stress adjustment layer may include a plurality of stress adjustmentpatterns disposed adjacent to each other.

The stress adjustment patterns may have any one selected from atriangular shape, a trapezoidal shape, and a semicircular shape.

Lower ends of adjacent stress adjustment patterns may be directlyconnected or spaced apart from each other.

The organic light emitting diode display panel may include a flatportion and bent portions positioned at ends of the flat portion.

The stress adjustment patterns may include first stress adjustmentpatterns positioned corresponding to the flat portion and second stressadjustment patterns corresponding to the bent portions. An intervalbetween the second stress adjustment patterns may be smaller than aninterval between the first stress adjustment patterns.

The interval between the first stress adjustment patterns and theinterval between the second stress adjustment patterns may intervalsbetween central axes of upper ends of the first and second stressadjustment patterns, respectively.

The lower passivation film may further include a plane passivation layerformed beneath the support film and adjacent to the stress adjustmentlayer.

The plane passivation layer may be positioned to correspond to the flatportion.

The organic light emitting diode display panel may include a flexiblesubstrate attached to a top of the lower passivation film. An organiclight emitting element may be formed on the flexible substrate. A thinfilm encapsulation layer may cover the organic light emitting element.

Another exemplary embodiment of the present invention provides a methodof manufacturing an organic light emitting diode display. The methodincludes fabricating a lower passivation film including a support film,a stress adjustment layer formed beneath the support film, and a releasefilm covering the stress adjustment layer; attaching the lowerpassivation film to a bottom of a flexible substrate; sequentiallyforming an organic light emitting element and a thin film encapsulationlayer on the flexible substrate; separating the release film from thelower passivation film to expose the stress adjustment layer; andforming a bent portion of the organic light emitting diode display panelby bending a portion of the organic light emitting diode display panel.

In the forming a bent portion, a first interval between stressadjustment patterns positioned corresponding to the bent portion may besmaller than a second interval between stress adjustment patternspositioned corresponding to a flat portion of the organic light emittingdiode display panel.

The stress adjustment patterns may have any one selected from atriangular shape, a trapezoidal shape, and a semicircular shape.

The first interval or the second interval may be an interval betweencentral axes of upper ends of adjacent stress adjustment patterns.

An OLED display according to an exemplary embodiment of the presentinvention includes an organic light emitting display panel configured todisplay an image, and a lower passivation film attached to a bottom ofthe organic light emitting diode display panel. The lower passivationfilm includes a support film contacting the organic light emitting diodedisplay panel and a stress adjustment layer formed beneath the supportfilm, where the stress adjustment layer includes a plurality of unitstress adjustment patterns, each having a quadrilateral base andarranged adjacent to each other. The unit stress adjustment patternseach include four stress adjustment patterns positioned adjacent to eachother and having pyramidal shapes.

The four stress adjustment patters of each unit stress adjustmentpattern may intersect at a common point. The unit stress adjustmentpatterns may be arranged in repeating manner along each of a horizontaldirection, a vertical direction, and a diagonal direction.

Bottom edges of two unit stress adjustment patterns positioned adjacentto each other along a diagonal direction may be connected to each other.

According to the exemplary embodiments of the present invention, in anorganic light emitting diode display, it is possible to selectivelyminimize stress in bent portions of an organic light emitting displaypanel by reducing an interval between stress adjustment patternspositioned corresponding to bent portions of the organic light emittingdiode display panel. Therefore, asymmetry of strains of the bendingportions of the organic light emitting diode display panel can beprevented to remove or reduce a picture abnormality.

Further, a stress adjustment layer is covered with a release film toflatten the lower passivation film before the stress adjustment layer ofthe lower passivation film is exposed. Thereby, it is possible toprevent a reduction in recognition ratio of an align mark due to opticalscattering by the stress adjustment patterns of a lower passivation filmduring a manufacturing process.

Further, when a chip on film (COF) is pressed onto the organic lightemitting diode display panel while the stress adjustment layer of thelower passivation film is exposed, a reduction in pressing force mayincrease a frequency of occurrence of pressing defects. However, it ispossible to prevent a reduction in pressing force and thus reduce afrequency of occurrence of pressing defects by pressing the chip on film(COF) onto the organic light emitting diode display panel while thestress adjustment layer is covered with the release film to flatten thelower passivation film. In addition, since a stress adjustment layerhaving triangular pyramid-shaped stress adjustment patterns is formed,the organic light emitting diode display panel can be easily bent alonga horizontal direction, a vertical direction, and a diagonal directionso that stress generated in the organic light emitting diode displaypanel when the organic light emitting diode display panel is being bentcan be minimized.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a lateral view of an organic light emitting diode displayaccording to a first exemplary embodiment of the present invention.

FIG. 2 is an equivalent circuit of one pixel of the organic lightemitting diode display according to the first exemplary embodiment ofthe present invention.

FIG. 3 is a graph of a defect occurrence ratio according to a bendingspeed of the organic light emitting diode display according to the firstexemplary embodiment of the present invention and a known organic lightemitting diode display.

FIGS. 4 to 6 are views sequentially showing a method of manufacturingthe organic light emitting diode display according to the firstexemplary embodiment of the present invention.

FIG. 7 is a lateral view of the organic light emitting diode displayaccording to a second exemplary embodiment of the present invention.

FIG. 8 is a lateral view of the organic light emitting diode displayaccording to a third exemplary embodiment of the present invention.

FIG. 9 is a lateral view of the organic light emitting diode displayaccording to a fourth exemplary embodiment of the present invention.

FIG. 10 is a graph showing comparison of stresses of the organic lightemitting diode displays according to the first to the fourth exemplaryembodiments of the present invention.

FIG. 11 is a lateral view of the organic light emitting diode displayaccording to a fifth exemplary embodiment of the present invention.

FIG. 12 is a lateral view of the organic light emitting diode displayaccording to a sixth exemplary embodiment of the present invention.

FIG. 13 is a side view of an OLED display according to a seventhexemplary embodiment of the present invention.

FIG. 14 is a top plan view of a stress adjustment layer of the OLEDdisplay according to the seventh exemplary embodiment of the presentinvention.

FIG. 15 is an enlarged top plan view of four unit stress adjustmentpatterns of FIG. 14.

FIG. 16 is an enlarged perspective view of the part V1 of FIG. 15.

FIG. 17 is a side view illustrating the OLED display in a bent stateaccording to the seventh exemplary embodiment of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Hereinafter, exemplary embodiments of the present invention will bedescribed in detail with reference to the accompanying drawings so thatthose skilled in the art may easily practice the present invention. Asthose skilled in the art would realize, the described embodiments may bemodified in various different ways, all without departing from thespirit or scope of the present invention.

In describing the present invention, parts that are not related to thedescription will be omitted. Like reference numerals generally designatelike elements throughout the specification.

In addition, the size and thickness of each element shown in thedrawings are arbitrarily shown for understanding and ease ofdescription, but the present invention is not limited thereto.

In the drawings, the thickness of layers, films, panels, regions, etc.,are exaggerated for clarity. In the drawings, for understanding and easeof description, the thicknesses of some layers and areas areexaggerated. The figures are thus not to scale. It will be understoodthat when an element such as a layer, film, region, or substrate isreferred to as being “on” another element, it may be directly on theother element or intervening elements may also be present.

In addition, unless explicitly described to the contrary, the word“comprise” and variations such as “comprises” or “comprising”, will beunderstood to imply the inclusion of stated elements but not theexclusion of any other elements. Further, in the specification, the word“˜on” means positioning on or below the object portion, but does notessentially mean positioning on the upper side of the object portionbased on a gravity direction.

In addition, in the accompanying drawings, an active matrix (AM) typeorganic light emitting diode display that has a 2Tr-1Cap structureincluding one pixel, two thin film transistors (TFT), and one capacitoris shown, but the present invention is not limited thereto. Accordingly,the organic light emitting diode display may include one pixel, aplurality of thin film transistors, and one or more capacitors, and aseparate wire may be further formed or a known wire may be omitted toprovide various structures. Here, the pixel means a minimum unitdisplaying an image, and the organic light emitting diode displaydisplays the image through a plurality of pixels.

An organic light emitting diode display according to a first exemplaryembodiment of the present invention will now be described in detail withreference to FIGS. 1 and 2.

FIG. 1 is a lateral view of an organic light emitting diode displayaccording to a first exemplary embodiment of the present invention. FIG.2 is an equivalent circuit of one pixel of an organic light emittingelement of the organic light emitting diode display according to thefirst exemplary embodiment of the present invention.

As shown in FIG. 1, the organic light emitting diode display accordingto the first exemplary embodiment of the present invention includes anorganic light emitting display panel 100 displaying an image, and alower passivation film 200 attached to a bottom of the organic lightemitting diode display panel 100.

The organic light emitting diode display panel 100 includes a flexiblesubstrate 110, an organic light emitting element 120 formed on theflexible substrate 110, and a thin film encapsulation layer 130 coveringthe organic light emitting element 120. The organic light emitting diodedisplay panel 100 may be divided into a flat or planar portion A, andcurved or bent portions B positioned at both ends of the plane portionA.

The flexible substrate 110 may be formed of a flexible film such aspolyimide.

As shown in FIG. 2, the organic light emitting element 120 includes aplurality of signal lines 121, 171, and 172, as well as a plurality ofpixels PX connected thereto and arranged in an approximate matrix form.

The signal lines include a plurality of scan lines 121 transferring ascan signal (or gate signal), a plurality of data lines 171 transferringa data signal, and a plurality of driving voltage lines 172 transferringa driving voltage ELVDD. The scan lines 121 extend in an approximate rowdirection and are substantially parallel to each other. The data lines171 and the driving voltage lines 172 extend in an approximate columndirection and are substantially parallel to each other. Each pixel PXincludes a switching thin film transistor T1, a driving thin filmtransistor T2, a storage capacitor Cst, and an organic light emittingdiode (OLED).

The switching thin film transistor T1 has a control terminal, an inputterminal, and an output terminal. The control terminal is connected tothe scan line 121, the input terminal is connected to the data line 171,and the output terminal is connected to the driving thin film transistorT2. The switching thin film transistor T1 is responsive to the scansignal applied to the scan line 121 to transfer the data signal appliedto the data line 171 to the driving thin film transistor T2.

Further, the driving thin film transistor T2 has a control terminal,input terminal, and output terminal. The control terminal is connectedto the switching thin film transistor T1, the input terminal isconnected to the output of the switching thin film transistor T1 and tothe control terminal of transistor T3, and the output terminal isconnected to the organic light emitting diode (OLED). The driving thinfilm transistor T2 allows an output current Id having a level varyingaccording to a voltage applied between the control terminal and theoutput terminal to flow.

The storage capacitor Cst is connected between the control terminal andthe input terminal of the driving thin film transistor T2. This storagecapacitor Cst charges the data signal applied to the control terminal ofthe driving thin film transistor T2 and maintains the data signal evenafter the switching thin film transistor T1 is turned-off.

The organic light emitting diode (OLED) has an anode connected to theoutput terminal of the driving thin film transistor T2, a cathodeconnected to a common voltage ELVSS, and an organic light emittingmember formed between the anode and the cathode. The organic lightemitting diode (OLED) displays an image by emitting light while theintensity is changed according to the output current Id of the drivingthin film transistor T2.

The switching thin film transistor T1 and the driving thin filmtransistor T2 may each be an n channel field effect transistor (FET) ora p channel field effect transistor. In addition, a connectionrelationship of the thin film transistors T1 and T2, the capacitor Cst,and the organic light emitting diode (OLED) may be changed. Embodimentsof the invention contemplate any structure and equivalent circuit forpixel PX, besides that shown in FIG. 2.

Meanwhile, the thin film encapsulation layer 130 covering the organiclight emitting element 120 may prevent oxygen and moisture from theoutside from flowing or diffusing into the organic light emittingelement 120, thus protecting the organic light emitting element 120.

The lower passivation film 200 includes a support film 210 that is incontact with the flexible substrate 110 of the organic light emittingdiode display panel 100, and a stress adjustment layer 220 formedbeneath the support film 210.

The stress adjustment layer 220 includes a plurality of stressadjustment patterns 20 disposed to be adjacent to each other. The stressadjustment patterns 20 include planar stress adjustment patterns 21formed at a position corresponding to the planar portion A, and bentstress adjustment patterns 22 formed at a position corresponding to thebent portions B.

An interval between the stress adjustment patterns 20 may be adjusted toadjust a strain of the organic light emitting diode display panel 100,thereby reducing stress of the bending portions B. That is, a bentinterval P2 between the bending stress adjustment patterns 22 is formedto be smaller than a planar interval P1 between the planar stressadjustment patterns 21.

Specifically, the planar interval P1 or the bent interval P2 is aninterval between central axes 220 a of upper ends (e.g., points, tips,or apexes) of the stress adjustment patterns 20. The stress adjustmentpatterns of the organic light emitting diode display according to thefirst exemplary embodiment of the present invention have a prism shapeas shown in FIG. 1. Accordingly, a cross-section thereof may have atriangular or other polygonal shape, and adjacent lower ends 220 b ofthe stress adjustment patterns 20 having the triangle shape are directlyconnected to each other (i.e. no space exists between adjacent patterns20). The interval between the stress adjustment patterns 20 having thetriangle shape is an interval between adjacent apexes 220 a.

As described above, stress of the bending portions of the organic lightemitting diode display panel may be minimized by reducing the bentinterval P2 between the bending stress adjustment patterns 22 attachedto a position corresponding to the bent portions B of the organic lightemitting diode display panel 100. Therefore, asymmetry of strains of thebent portions of the organic light emitting diode display panel may beprevented to remove or prevent picture abnormalities. That is, thewidths of patterns 22 in bent portion B can be adjusted so as to reduceor eliminate bending strain that would be induced in portion B when itis bent.

The lower passivation film 200 may include any material selected from UVepoxys, urethane acrylates, acrylates, or the like.

As described above, the lower passivation film 200 having the stressadjustment layer 220 may be attached to a bottom of the organic lightemitting diode display panel 100 to prevent physical damage to theflexible substrate 110 of the organic light emitting diode display panel100 and to minimize stress in the bent portions B of the organic lightemitting diode display panel 100. Accordingly, asymmetry of strains ofthe bent portions B may be prevented, so as to remove pictureabnormalities.

Meanwhile, a shape change prevention layer 300 for preventing a shapechange of the stress adjustment layer 220 may be attached to a bottom ofthe lower passivation film 200.

FIG. 3 is a graph of a defect occurrence ratio according to a bendingspeed of the organic light emitting diode display according to the firstexemplary embodiment of the present invention and according to a knownconventional organic light emitting diode display.

The defect occurrence ratio of FIG. 3 refers to a ratio of probabilityof occurrence of an image quality defect when ten organic light emittingdiode displays are bent to have a curvature radius of 3 mm. When the tenorganic light emitting diode displays are bent and abnormality occurs inone organic light emitting diode display, the defect occurrence ratiohas a value of 10%. The speed of FIG. 3 refers to the rate of bending ofthe organic light emitting diode display. When the organic lightemitting diode display is more rapidly bent, larger force is applied todamage the organic light emitting diode display.

As shown in FIG. 3, it can be seen that in the conventional organiclight emitting diode display X1, as the bending speed is increased, thedefect occurrence ratio rapidly increases, and a 100% defect rate occursat a speed of 150 mm/s or more. However, it can be seen that in theorganic light emitting diode display X2 according to the first exemplaryembodiment of the present invention, even when the bending speed is 150mm/s or more, the defect occurrence ratio of 40% or less is maintained.As described above, it can be seen that even though the organic lightemitting diode display X2 according to the first exemplary embodiment ofthe present invention is bent at a higher speed as compared to the knownorganic light emitting diode display X1, the defect occurrence ratio isreduced.

A method of manufacturing the organic light emitting diode displayaccording to the first exemplary embodiment of the present inventionwill be described below in detail with reference to FIGS. 4 to 6.

FIGS. 4 to 6 are views sequentially showing a method of manufacturingthe organic light emitting diode display according to the firstexemplary embodiment of the present invention.

First, as shown in FIG. 4, the lower passivation film 200 ismanufactured. The lower passivation film 200 includes the support film210, the stress adjustment layer 220 formed beneath the support film210, and the release film 230 covering the stress adjustment layer 220.The stress adjustment layer 220 includes a plurality of stressadjustment patterns 20 disposed to be adjacent to each other.

In addition, the lower passivation film 200 is attached to the bottom ofthe flexible substrate 110. Also, the organic light emitting element 120and the thin film encapsulation layer 130 are sequentially formed on theflexible substrate 110 to complete the organic light emitting diodedisplay panel 100.

As described above, the stress adjustment layer 220 is covered with therelease film 230 to flatten the lower passivation film 200 while thestress adjustment layer 220 of the lower passivation film is not firstexposed, thus completing the organic light emitting diode display panel100. Thereby, a reduction in recognition ratio of an align mark due tooptical scattering by the stress adjustment patterns 20 of the lowerpassivation film 200 may be prevented during the manufacturing process.

Further, when a chip on film (COF) is pressed onto the organic lightemitting diode display panel 100 while the stress adjustment layer 220of the lower passivation film 200 is exposed, a reduction in pressingforce may increase a frequency of occurrence of pressing defects.However, pressing force may be prevented from being reduced, and thefrequency of occurrence of pressing defects may thus be reduced, bypressing the chip on film (COF) onto the organic light emitting diodedisplay panel 100 while the stress adjustment layer 220 is covered withthe release film 230 to flatten the lower passivation film 200.

Next, as shown in FIG. 5, the release film 230 is separated from thelower passivation film 200 to expose the stress adjustment layer 220. Inthis case, a space is formed between the adjacent stress adjustmentpatterns 20 of the stress adjustment layer 220.

Next, as shown in FIG. 6, a portion of the organic light emitting diodedisplay panel 100 is bent to form the bent portion B. In this case, thespace between the bending stress adjustment patterns 22 at a positioncorresponding to the bent portion B is reduced.

Accordingly, the bent interval P2 between the bending stress adjustmentpatterns 22 corresponding to the bent portion B is smaller than theplanar interval P1 between the plane stress adjustment patterns 21corresponding to the planar portion A of the organic light emittingdiode display panel 100. In this case, the planar interval P1 or thebent interval P2 may be an interval between the central axes 220 a ofadjacent stress adjustment patterns 20.

The lower ends of the adjacent stress adjustment patterns having thetriangle shape are directly connected to each other in the firstexemplary embodiment. However, other configurations are contemplated,and the lower ends of the adjacent stress adjustment patterns may bespaced apart from each other at a predetermined interval.

Hereinafter, the organic light emitting diode display according to asecond exemplary embodiment of the present invention will be describedin detail with reference to FIG. 7.

FIG. 7 is a lateral view of the organic light emitting diode displayaccording to a second exemplary embodiment of the present invention.

The second exemplary embodiment is substantially the same as the firstexemplary embodiment shown in FIGS. 1 and 2, with the exception of theinterval between the lower ends of the stress adjustment patterns of thelower passivation film, and thus any repetitive description thereof willbe omitted.

As shown in FIG. 7, the stress adjustment patterns 20 of the organiclight emitting diode display according to the second exemplaryembodiment of the present invention have a triangular shape. The lowerends 220 b of the adjacent stress adjustment patterns 20 are connectedwhile being spaced apart from each other at a predetermined interval d.In the stress adjustment patterns 20 having the aforementioned shape,stress occurring in the bent portion B may be further minimized.

Meanwhile, the stress adjustment patterns having the triangular shapeare formed as in the first exemplary embodiment. However, other shapesare also contemplated. For example, stress adjustment patterns having atrapezoid or other polygonal shape are formed.

Hereinafter, organic light emitting diode displays according to thirdand the fourth exemplary embodiments of the present invention will bedescribed in detail with reference to FIGS. 8 and 9.

FIG. 8 is a lateral view of an organic light emitting diode displayaccording to a third exemplary embodiment of the present invention, andFIG. 9 is a lateral view of an organic light emitting diode displayaccording to a fourth exemplary embodiment of the present invention.

The third and the fourth exemplary embodiments are substantially thesame as the first and the second exemplary embodiments shown in FIGS. 1and 7, with the exception of the shapes of the stress adjustmentpatterns of the lower passivation film, and thus any repetitivedescription thereof will be omitted.

First, as shown in FIG. 8, the stress adjustment patterns 20 of theorganic light emitting diode display according to the third exemplaryembodiment of the present invention have a trapezoidal shape. The lowerends 220 b of the adjacent stress adjustment patterns 20 having thetrapezoid shape are directly connected to each other. The intervals P1and P2 between the stress adjustment patterns 20 having the trapezoidalshape are intervals between the central axes 220 a of adjacenttrapezoidal shapes.

Further, as shown in FIG. 9, the stress adjustment patterns 20 of theorganic light emitting diode display according to the fourth exemplaryembodiment of the present invention have a trapezoidal shape. The lowerends 220 b of the adjacent trapezoidal stress adjustment patterns 20 areconnected while being spaced apart from each other at a predeterminedinterval d. The intervals P1 and P2 between the stress adjustmentpatterns 20 having the trapezoid shape are intervals between the centralaxes 220 a of adjacent trapezoidal shapes.

In the stress adjustment patterns 20 having the trapezoidal shapes shownin FIGS. 8 and 9, stress occurring in the bent portion B may be furtherminimized as compared to the stress adjustment patterns 20 having thetriangular shape shown in FIGS. 1 and 7.

FIG. 10 is a graph comparing stresses generated at outer surfaces oforganic light emitting diode displays constructed according to the firstthrough fourth exemplary embodiments of the present invention.

As shown in FIG. 10, tensile stress and compressive stress of the thirdand the fourth exemplary embodiments with trapezoidal stress adjustmentpatterns are reduced as compared to the first and the second exemplaryembodiments with triangular stress adjustment patterns.

Further, it can be seen that tensile stress and compressive stress inthe second exemplary embodiment, where the lower ends of the stressadjustment patterns are connected while being spaced apart from eachother at a predetermined interval, are reduced as compared to the firstexemplary embodiment where the lower ends of the stress adjustmentpatterns are directly connected. In addition, it can be seen thattensile stress and compressive stress of the fourth exemplaryembodiment, where the lower ends of the stress adjustment patterns areconnected while being spaced apart from each other at a predeterminedinterval, are reduced as compared to the third exemplary embodimentwhere the lower ends of the stress adjustment patterns are directlyconnected.

The first embodiment utilizes triangular stress adjustment patterns.However, the invention is not limited to this configuration. Forexample, a fifth exemplary embodiment is feasible, in which stressadjustment patterns having a semicircular shape are utilized.

Hereinafter, the organic light emitting diode display according to thisfifth exemplary embodiment of the present invention will be described indetail with reference to FIG. 11.

FIG. 11 is a lateral view of an organic light emitting diode displayaccording to the fifth exemplary embodiment of the present invention.

The fifth exemplary embodiment is substantially the same as the firstexemplary embodiment shown in FIGS. 1 and 2, with the exception of theshapes of the stress adjustment patterns of the lower passivation film,and thus any repetitive description thereof will be omitted.

As shown in FIG. 11, the stress adjustment patterns 20 of the organiclight emitting diode display according to the fifth exemplary embodimentof the present invention have a semicircular shape. The lower ends 220 bof adjacent semicircular stress adjustment patterns 20 are connectedwhile being spaced apart from each other at a predetermined interval d.In the stress adjustment patterns 20 having the aforementioned shape,stress occurring in the bent portion B may be further minimized.

Meanwhile, the stress adjustment patterns are formed across the entirelower passivation film in the first exemplary embodiment. However, asixth exemplary embodiment is also contemplated, in which the stressadjustment patterns are not formed in a portion of the lower passivationfilm.

Hereinafter, the organic light emitting diode display according to thesixth exemplary embodiment of the present invention will be described indetail with reference to FIG. 12.

FIG. 12 is a lateral view of the organic light emitting diode displayaccording to the sixth exemplary embodiment of the present invention.

The sixth exemplary embodiment is substantially the same as the firstexemplary embodiment shown in FIGS. 1 and 2 with the exception of thestress adjustment patterns of the lower passivation film, and thus anyrepetitive description thereof will be omitted.

As shown in FIG. 12, the lower passivation film 200 of the organic lightemitting diode display according to the sixth exemplary embodiment ofthe present invention includes the support film 210 that is in contactwith the flexible substrate 110 of the organic light emitting diodedisplay panel 100, the stress adjustment layer 220 formed beneath thesupport film 210, and a plane passivation layer 240 formed beneath thesupport film 210 and adjacent to the stress adjustment layer 220.

The stress adjustment layer 220 includes a plurality of stressadjustment patterns 20 disposed to be adjacent to each other. The stressadjustment patterns 20 include stress adjustment patterns 21 formed at aposition corresponding to the planar portion A, and bent stressadjustment patterns 22 formed at a position corresponding to the bentportions B. The interval between the stress adjustment patterns 20 maybe adjusted to adjust a strain of the organic light emitting diodedisplay panel 100, thereby reducing stress in the bent portions B. Thatis, the bending interval P2 between the bent stress adjustment patterns22 is formed to be smaller than the interval P1 between the stressadjustment patterns 21.

In this case, the plane passivation layer 240 is formed at mostpositions corresponding to the planar portion A that are not bent, andthe bent stress adjustment pattern 22 is formed only at a positioncorresponding to the bent portion B. Accordingly, the lower passivationfilm 200 protecting the organic light emitting diode display panel 100from the outside may function sufficiently.

Meanwhile, the stress adjustment pattern is formed in the shape of aprism in the first exemplary embodiment, but the stress adjustmentpattern according to a seventh exemplary embodiment of the presentinvention may be formed in the shape of a triangular pyramid.

FIG. 13 is a side view of an OLED display according to a seventhexemplary embodiment of the present invention, FIG. 14 is a top planview of a stress adjustment layer of the OLED display according to theseventh exemplary embodiment of the present invention, FIG. 15 is anenlarged top plan view of four unit stress adjustment patterns of FIG.14, and FIG. 17 is a side view illustrating the OLED display in a bentstate according to the seventh exemplary embodiment of the presentinvention.

As shown in FIG. 13, an OLED display according to the seventh exemplaryembodiment of the present invention includes an organic light emittingdisplay panel 100, a lower passivation film 200 attached to a bottom ofthe organic light emitting diode display panel 100, and an adhesive 300attaching the lower passivation film 200 to the organic light emittingdiode display panel 100.

The organic light emitting diode display panel 100 includes a flexiblesubstrate 110, an organic light emitting element 120 formed on theflexible substrate 110, and a thin film encapsulation layer 130 coveringthe organic light emitting element 120.

The flexible substrate 110 may be formed of a flexible film such aspolyimide.

The lower passivation film 200 prevents the flexible substrate frombeing damaged and eases handling of the organic light emitting diodedisplay panel during manufacture, and may include a material selectedfrom UV epoxys, urethane acrylates, and acrylates.

Such a lower passivation film 200 includes a support film 210 attachedto the flexible substrate 110 using an adhesive 300 and a stressadjustment layer 220 formed beneath the support film 210.

The stress adjustment layer 220 includes a plurality of unit stressadjustment patterns U disposed to be adjacent to each other. The unitstress adjustment patterns U are respectively formed in the shape ofsquares when viewed in plan view, and include four stress adjustmentpatterns V1, V2, V3, and V4, which are protrusions, each formed in theshape of a triangular pyramid. The four stress adjustment patterns V1,V2, V3, and V4 correspond to an upper stress adjustment pattern V1, alower stress adjustment pattern V2, a left stress adjustment pattern V3,and a right stress adjustment pattern V4.

The upper stress adjustment pattern V1 and the lower stress adjustmentpattern V2 are disposed to be symmetric to each other, and the leftstress adjustment pattern V3 and the right stress adjustment pattern V4are disposed to be symmetric to each other. In this case, bottom edgesof stress adjustment patterns V1, V2, V3, and V4 that neighbor eachother are directly connected with each other, and a vertex of one of thefour triangular pyramid-shaped stress adjustment patterns V1, V2, V3,and V4 is shared. That is, the upper stress adjustment pattern V1, theleft stress adjustment pattern V2, the left stress adjustment patternV3, and the right stress adjustment pattern V4 share a vertex 220 c thatcorresponds to an axis of symmetry.

A portion that corresponds to the triangular pyramid-shaped bottom edge220 b is as thin as a thickness d of the support film 210, and thereforethe stress adjustment patterns V1, V2, V3, and V4 can be easily bentalong the bottom edges 220 b.

As shown in FIG. 14, a unit stress adjustment pattern U formed of thefour stress adjustment patterns V1, V2, V3, and V4 is arranged inrepeating manner along a horizontal direction X and a vertical directionY, and it is also arranged in repeating manner along a diagonaldirection Z. In this case, as shown in FIG. 16, bottom edges 220 b ofthe stress adjustment patterns V1, V2, V3, and V4 in two unit stressadjustment patterns U that neighbor each other are connected with eachother, thereby forming a straight line.

Therefore, the bottom edges 220 b of the stress adjustment patterns V1,V2, V3, and V4 are connected to each other along the horizontaldirection X, the vertical direction Y, and the diagonal direction Z sothat they can be easily bent along the horizontal direction X, thevertical direction Y, and/or the diagonal direction Z.

Thus, as shown in FIG. 13 and FIG. 17, in the OLED display according tothe exemplary embodiment of the present invention, a bent gap P2 betweenupper vertexes 220 a of the stress adjustment patterns V1, V2, V3, andV4 in a bent state becomes smaller than a planar gap P1 between uppervertexes 220 a of the stress adjustment patterns in a planar state.

As described, the stress adjustment layer 220 can be easily bent alongthe horizontal direction X, the vertical direction Y, and the diagonaldirection Z by forming the stress adjustment layer 220 having triangularpyramid-shaped stress adjustment patterns V1, V2, V3, and V4, andtherefore a stress generated in the organic light emitting diode displaypanel 100 when the organic light emitting diode display panel 100 isbeing bent can be minimized. Accordingly, when the organic lightemitting diode display panel is bent, asymmetry in a strain of theorganic light emitting diode display panel can be prevented, therebypreventing abnormality in the screen.

While this invention has been described in connection with what ispresently considered to be practical exemplary embodiments, it is to beunderstood that the invention is not limited to the disclosedembodiments, but, on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the scope ofthe appended claims, detailed description of the invention, anddrawings. Additionally, various features of the above describedembodiments may be mixed and matched in any combinations so as toproduce further embodiments.

<Description of symbols> 100: organic light emitting display panel 200:lower passivation film 210: support film 220: stress adjustment layer240: plane passivation layer

What is claimed is:
 1. An organic light emitting diode displaycomprising: an organic light emitting display panel including a flatportion and a bent portion, and a lower passivation film attached to abottom of the organic light emitting diode display panel, wherein thelower passivation film includes a stress adjustment portion at leastpositioned corresponding to the bent portion and having a spaceconfigured to reduce a bending stress to be induced in the organic lightemitting display panel when the organic light emitting display panel andthe lower passivation film are bent.
 2. The organic light emitting diodedisplay of claim 1, wherein the bent portion is positioned at an end ofthe flat portion.
 3. The organic light emitting diode display of claim1, wherein the stress adjustment portion includes a plurality of stressadjustment patterns disposed around the space and adjacent to eachother.
 4. The organic light emitting diode display of claim 3, whereinlower ends of adjacent stress adjustment patterns are directlyconnected.
 5. The organic light emitting diode display of claim 3,wherein lower ends of adjacent stress adjustment patterns are spacedapart from each other.
 6. The organic light emitting diode display ofclaim 1, wherein the stress adjustment portion has stress adjustmentpatterns having any one selected from a triangular shape, a trapezoidalshape, a semicircular shape and a quadrantal shape.
 7. The organic lightemitting diode display of claim 6, wherein: the stress adjustmentpatterns include first stress adjustment patterns positionedcorresponding to the flat portion and second stress adjustment patternspositioned corresponding to the bent portions, and an interval betweenthe second stress adjustment patterns is smaller than an intervalbetween the first stress adjustment patterns.
 8. The organic lightemitting diode display of claim 7, wherein the interval between thefirst stress adjustment patterns and the interval between the secondstress adjustment patterns are intervals between central axes of upperends of the first and second stress adjustment patterns, respectively.9. The organic light emitting diode display of claim 6, wherein thelower passivation film further includes: a support film positionedbetween the stress adjustment portion and the organic light emittingdiode display panel; and a plane passivation layer formed beneath thesupport film and adjacent to the stress adjustment layer.
 10. Theorganic light emitting diode display of claim 9, wherein the planepassivation layer is positioned to correspond to the flat portion.
 11. Adisplay comprising: a display panel including a flat portion and a bentportion, and a lower passivation film attached to a surface of thedisplay panel and including a bent stress adjustment pattern positionedcorresponding to the bent portion.
 12. The display of claim 11, whereinthe bent stress adjustment pattern comprises a cutout in the lowerpassivation film.
 13. The display of claim 11, wherein the lowerpassivation film includes a flat stress adjustment pattern extendingfrom the bent stress adjustment pattern and positioned to correspond tothe flat portion.
 14. The display of claim 11, wherein the lowerpassivation film includes a plurality of the bent stress adjustmentpatterns, wherein successive ones of the plurality of bent stressadjustment patterns are positioned in adjacent manner.
 15. The displayof claim 14, wherein lower ends of adjacent bent stress adjustmentpatterns are directly connected.
 16. The display of claim 11, whereinthe bent portion is positioned at an end of the flat portion.
 17. Thedisplay of claim 11, the lower passivation film includes: a support filmthat is in contact with the display panel, a stress adjustment layerformed beneath the support film and including the bent stress adjustmentpattern in order to reduce a bending stress to be induced in the displaypanel when the display panel and the lower passivation film are bent,and a plane passivation layer formed beneath the support film andadjacent to the stress adjustment layer.